As device geometries shrink, semiconductor assembly process becomes more complex. Increasing the severity of this complex problem is the increasing diversity and sophistication of microelectronics that requires a greater variety advanced package types.

Altmes understands the importance of selecting the proper packaging solution to meet the technical and cost constraints of each design. Our packaging engineers bring in years of packaging experience and gets involved early in the design cycle. We work with our customers to evaluate the package options (BGA, Lead Frame, Flipchip and SIP/MCM) that are best optimized for the application requirements of the design. Our engineers work very closely with design engineers to ensure substrate design meets product specification.

In order to address these packaging challenges, Altmes recognizes the need for relationships with firms that offer full complement of packaging and test solutions and services. Further more proximity of these top tier firms creates a seamless working environment between two engineering groups which result in a much faster resolution of issues. All our partners are located in Taiwan and China and have strategic relationships with ASE, TSE, TICP in packaging and Assembly area.